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SHENZHEN, China - Michimich -- The 25th China International Optoelectronic Exposition (CIOE 2024) took place from September 11-13, 2024, at the Shenzhen International Convention and Exhibition Center, showcasing the scale and influence of the optoelectronic industry. T&S Communications participated in the event, presenting its latest products and technological solutions in optical fiber communications, data centers, and fiber optic sensing.
T&S highlighted several leading optical communication solutions, including 800G high-speed optical modules, AOC, various passive optical components, high-density cabling enclosures, and high-density fiber optic connectivity products and solutions. These innovations are widely applicable in cutting-edge sectors such as large-scale data centers, supercomputing centers, 5G communications, and industrial IoT. Notable attractions included the fiber optic flex circuit series and the 16F SM low-loss MT ferrules, which garnered significant attention from industry professionals.
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Industry Recognition
On September 11, 2024, the CIOE 25th Anniversary Celebration took place at the Shenzhen International Convention and Exhibition Center. Mr. Cao, the Domestic Market Manager for T&S, represented the company at this prestigious event.
During the celebration, T&S was awarded the "Gold Medal" by the CIOE Organizing Committee in recognition of its long-standing contributions and technological innovations in the industry. This award underscores T&S' more than 15 years of dedicated support and cooperation, affirming its position as a key player in the global optical communications field.
Engaging in Industry Forums
Simultaneously, T&S participated in the 22nd ICCSZ Market and Technology Symposium, themed "Cross-Border Integration, Intelligent Future." The forum focused on AI, ultra-high-speed optical interconnections, and next-generation data transmission technologies, attracting over 1,500 top experts, industry leaders, and professionals from around the globe.
Mr. Jacky Hou, T&S' Assistant Technical Director, was invited as a guest speaker to share insights on the company's latest breakthroughs in high-speed optical interconnection component development and exploring future directions for technological innovation.
T&S highlighted several leading optical communication solutions, including 800G high-speed optical modules, AOC, various passive optical components, high-density cabling enclosures, and high-density fiber optic connectivity products and solutions. These innovations are widely applicable in cutting-edge sectors such as large-scale data centers, supercomputing centers, 5G communications, and industrial IoT. Notable attractions included the fiber optic flex circuit series and the 16F SM low-loss MT ferrules, which garnered significant attention from industry professionals.
More on Michimich.com
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Industry Recognition
On September 11, 2024, the CIOE 25th Anniversary Celebration took place at the Shenzhen International Convention and Exhibition Center. Mr. Cao, the Domestic Market Manager for T&S, represented the company at this prestigious event.
During the celebration, T&S was awarded the "Gold Medal" by the CIOE Organizing Committee in recognition of its long-standing contributions and technological innovations in the industry. This award underscores T&S' more than 15 years of dedicated support and cooperation, affirming its position as a key player in the global optical communications field.
Engaging in Industry Forums
Simultaneously, T&S participated in the 22nd ICCSZ Market and Technology Symposium, themed "Cross-Border Integration, Intelligent Future." The forum focused on AI, ultra-high-speed optical interconnections, and next-generation data transmission technologies, attracting over 1,500 top experts, industry leaders, and professionals from around the globe.
Mr. Jacky Hou, T&S' Assistant Technical Director, was invited as a guest speaker to share insights on the company's latest breakthroughs in high-speed optical interconnection component development and exploring future directions for technological innovation.
Source: T&S COMMUNICATIONS CO., LTD.
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