T&S and US Conec Ink Global Licensing Deal on MDC Technology to Advance High-Density Optical Interconnects
Michimich.com/10294445

SAN FRANCISCO - Michimich -- (OFC 2025) – During the OFC 2025 conference, T&S Communication and US Conec formally entered into a global patent licensing agreement covering MDC connectors and adapters.

Through this agreement, T&S obtains non-exclusive rights to 11 key US Conec patents, enabling the company to manufacture and distribute MDC high-density optical connectors and adapters worldwide. These interconnect solutions are vital for next-generation Ethernet applications including 800G and 1.6T.

As AI computing environments expand to include clusters exceeding 100,000 GPUs, the need for compact, high-throughput optical links has grown significantly—highlighting the limitations of conventional fiber connectors. The MDC platform, with its compact duplex form factor and robust signal integrity, offers a future-ready alternative for dense optical deployments. This licensing partnership is set to speed up ecosystem alignment and support broader adoption of 800G OSFP and QSFP-DD modules, while also enabling dependable board-level connectivity for emerging Co-Packaged Optics (CPO) systems.

More on Michimich.com

• Assent Unveils Extended Producer Responsibility Packaging Solution to Simplify Compliance with Expanding Packaging Laws
• KatalisCoin: "Too Secure" for Bad Actors - Platform Embraces "Excessive Compliance" Criticism
• Keyanb Exchange Implements Enhanced Security Protocols Amid Industry-Wide Trust Challenges
• TSWHZC Platform Combines Automated Portfolio Management with Proof of Reserves for Brazil Market Entry
• AureaVault Positions Digital Asset Infrastructure for Shifting Monetary Policy Environment

In addition to manufacturing MDC connectors and adapters, T&S will introduce a complete product line featuring MDC duplex and MMC multi-fiber cabling systems, as well as compatible transceivers. These offerings will further reinforce the company's position in the high-density optical interconnection segment.

About T&S Communication
T&S Communication, based in Shenzhen, China, is a leading global provider of optical interconnect solutions. The company supplies a broad array of products to telecom operators and data communication service providers, including ceramic ferrules, MT ferrules, high-density connectivity components, active optical devices, and fiber sensing technologies. Learn more at www.china-tscom.com.

About US Conec
US Conec is a pioneer in high-density fiber optic interconnection technology. With more than 30 years of innovation, the company serves data centers, telecom infrastructure, industrial systems, and defense applications around the world. US Conec is jointly owned by industry leaders Corning Optical Communications, Fujikura, and NTT-AT. For additional information, visit www.usconec.com.